Attributes

Part Number
MT8870DS
Footprint 0 Description
SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Medium Density
Manufacturer
Zarlink Semiconductor
Footprint 2 Description
SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Low Density
Description
Integrated DTMF Receiver
Packagedescription
18-Pin Small Outline Integrated Circuit 1.27 mm Pitch
Prefix
U
Manufacturer Link
http://products.zarlink.com

Design Files