Texas Instruments BQ294700DSGR

Reference Designs (4)

Attributes

Part Number
Manufacturer
Datasheet
Prefix
U
Conn 0 Type
power
Conn 1 Type
input
Conn 2 Type
input
Conn 3 Type
input
Conn 4 Type
input
Conn 5 Type
power
Conn 6 Type
output
Conn 7 Type
output
Conn 8 Type
power
Digikey Description
Battery Battery Protection IC Lithium-Ion 8-WSON (2x2)
Digikey Part Number
296-34984-1-ND
Lead Free
yes
Mfg Package Ident
DSG (S-PWSON-N8)
Mouser Part Number
595-BQ294700DSGR
Package
WSON-8
RoHS
yes
Temperature Range High
+85°C
Temperature Range Low
-40°C
Verified Attributes
true
Verified Geometry
true
Verified Pad Assignment
true
Verified Pin Names
true

Pins

1
VDD
2
V4
3
V3
4
V2
5
V1
6
VSS
7
CD
8
OUT
9
GND_PAD

Contributors

Datasheet Preview

100 Ω
VCELL1
VCELL
3
VCELL
2
OUT
VDD
VSS
0.1
µ
F
1k
1k
Pack
+
Pack
V3
V2 V1
V4 CD
VCELL
4
PWPD
0.1
µ
F
0.1µF
0.1µF
0.1µF
1k
1k
0.1µF
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
bq294700
,
bq294701
,
bq294702
bq294703
,
bq294704
,
bq294705
,
bq294707
SLUSB15B SEPTEMBER 2012REVISED DECEMBER 2014
bq2947xy Overvoltage Protection for 2-Series to 4-Series Cell Li-Ion Batteries
with External Delay Capacitor
1 Features 3 Description
The bq2947xy family is an overvoltage monitor and
1
2-, 3-, and 4-Series Cell Overvoltage Protection
protector for Li-Ion battery pack systems. Each cell is
External Capacitor-Programmed Delay Timer
monitored independently for an overvoltage condition.
Factory Programmed OVP Threshold (Threshold
In the bq2947xy device, an external delay timer is
Range 3.85 V to 4.6 V)
initiated upon detection of an overvoltage condition
Output Options: Active High or Open Drain Active
on any cell. Upon expiration of the delay timer, the
Low
output is triggered into its active state (either high or
low, depending on the configuration). The external
High-Accuracy Overvoltage Protection: ±10 mV
delay timer feature also includes the ability to detect
Low Power Consumption I
CC
1 µA
an open or shorted delay capacitor on the CD pin,
(V
CELL(ALL)
< V
PROTECT
)
which will similarly trigger the output driver in an
Low Leakage Current Per Cell Input < 100 nA
overvoltage condition.
Small Package Footprint
For quicker production-line testing, the bq2947xy
8-Pin WSON (2.00 mm x 2.00 mm)
device provides a Customer Test Mode with reduced
delay time.
2 Applications
Device Information
(1)
Notebook
PART NUMBER PACKAGE BODY SIZE (NOM)
UPS Battery Backup
bq294700 WSON (8) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
bq294700
,
bq294701
,
bq294702
bq294703
,
bq294704
,
bq294705
,
bq294707
SLUSB15B SEPTEMBER 2012REVISED DECEMBER 2014
www.ti.com
Table of Contents
9.3 Feature Description................................................... 8
1 Features.................................................................. 1
9.4 Device Functional Modes........................................ 10
2 Applications ........................................................... 1
10 Application and Implementation........................ 12
3 Description ............................................................. 1
10.1 Application Information.......................................... 12
4 Simplified Schematic............................................. 1
10.2 Typical Applications .............................................. 12
5 Revision History..................................................... 2
11 Power Supply Recommendations ..................... 15
6 Device Options....................................................... 3
12 Layout................................................................... 15
7 Pin Configuration and Functions......................... 3
12.1 Layout Guidelines ................................................. 15
8 Specifications......................................................... 4
12.2 Layout Example .................................................... 15
8.1 Absolute Maximum Ratings ...................................... 4
13 Device and Documentation Support ................. 16
8.2 ESD Ratings.............................................................. 4
13.1 Documentation Support ........................................ 16
8.3 Recommended Operating Conditions....................... 4
13.2 Related Links ........................................................ 16
8.4 Thermal Information.................................................. 4
13.3 Trademarks........................................................... 16
8.5 Electrical Characteristics........................................... 5
13.4 Electrostatic Discharge Caution............................ 16
8.6 Typical Characteristics.............................................. 7
13.5 Glossary................................................................ 16
9 Detailed Description.............................................. 8
14 Mechanical, Packaging, and Orderable
9.1 Overview ................................................................... 8
Information ........................................................... 16
9.2 Functional Block Diagram ......................................... 8
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (June 2013) to Revision B Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
Changes from Original (September 2012) to Revision A Page
Added the bq294707 device to Production Data.................................................................................................................... 1
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1
3
2
6
4
5
7
8
VDD
V3
V2
V4
OUT
VSS
V1
CD
bq294700
,
bq294701
,
bq294702
bq294703
,
bq294704
,
bq294705
,
bq294707
www.ti.com
SLUSB15B SEPTEMBER 2012REVISED DECEMBER 2014
6 Device Options
PART NUMBER OVP (V) OV HYSTERESIS OUTPUT DRIVE
bq294700 4.350 0.300 CMOS Active High
bq294701 4.250 0.300 CMOS Active High
bq294702 4.300 0.300 CMOS Active High
bq294703 4.325 0.300 CMOS Active High
bq294704 4.400 0.300 CMOS Active High
bq294705 4.450 0.300 CMOS Active High
bq294706 4.550 0.300 CMOS Active High
bq294707 4.225 0.050 NCH Open Drain Active Low
bq2947xy 3.850–4.60 0–0.300 CMOS Active High or Open Drain Active Low
7 Pin Configuration and Functions
DSG Package
8-Pin WSON
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
CD 7 OA External capacitor connection for delay timer
OUT 8 OA Analog Output drive for overvoltage fault signal. Active High or Open Drain Active Low
PWPD 9 P TI recommends connecting the exposed pad to VSS on PCB.
V1 5 IA Sense input for positive voltage of the lowest cell in the stack
V2 4 IA Sense input for positive voltage of the second cell from the bottom of the stack
V3 3 IA Sense input for positive voltage of the third cell from the bottom of the stack
V4 2 IA Sense input for positive voltage of the fourth cell from the bottom of the stack
VDD 1 P Power supply input
VSS 6 P Electrically connected to IC ground and negative terminal of the lowest cell in the stack
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bq294700
,
bq294701
,
bq294702
bq294703
,
bq294704
,
bq294705
,
bq294707
SLUSB15B SEPTEMBER 2012REVISED DECEMBER 2014
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage range VDD–VSS –0.3 30 V
Input voltage range V4–V3, V3–V2, V2–V1, V1–VSS, or CD–VSS –0.3 30 V
Output voltage range OUT–VSS –0.3 30 V
Continuous total power dissipation, P
TOT
See Thermal Information
Lead temperature (soldering, 10 s), T
SOLDER
300
°C
Storage temperature, T
stg
–65 150
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum–rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
±2000
all pins
(1)
Electrostatic
V
(ESD)
V
discharge
Charged device model (CDM), per JEDEC specification
±500
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
Over-operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage, V
DD
3 20 V
Input voltage range V4–V3, V3–V2, V2 –V1, V1–VSS, or CD–VSS 0 5 V
Operating ambient temperature range, T
A
–40 110 °C
8.4 Thermal Information
bq2947xy
THERMAL METRIC
(1)
SON UNIT
8 PINS
R
θJA
Junction-to-ambient thermal resistance 62
R
θJC(top)
Junction-to-case(top) thermal resistance 72
R
θJB
Junction-to-board thermal resistance 32.5
°C/W
ψ
JT
Junction-to-top characterization parameter 1.6
ψ
JB
Junction-to-board characterization parameter 33
R
θJC(bottom)
Junction-to-case(bottom) thermal resistance 10
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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