Texas Instruments CC2540F256RHAT

Reference Designs (7)

Attributes

Part Number
Manufacturer
Datasheet
Prefix
U
Centroid Not Specified
No
Digikey Description
IC RF TXRX+MCU BLUETOOTH 40VFQFN
Digikey Part Number
296-27922-1-ND
Lead Free
yes
Mfg Package Ident
Mouser Part Number
595-CC2540F256RHAT
Package
VQFN40
RoHS
yes
Temperature Range High
+85°C
Temperature Range Low
-40°C
Verified Attributes
true
Verified Geometry
true
Verified Pad Assignment
true
Verified Pin Names
true

Pins

1
DGND_USB
2
USB_P
3
USB_N
4
DVDD_USB
5
P1_5
6
P1_4
7
P1_3
8
P1_2
9
P1_1
10
DVDD2
11
P1_0
12
P0_7
13
P0_6
14
P0_5
15
P0_4
16
P0_3
17
P0_2
18
P0_1
19
P0_0
20
RESET_N
21
AVDD5
22
XOSC_Q1
23
XOSC_Q2
24
AVDD3
25
RF_P
26
RF_N
27
AVDD2
28
AVDD1
29
AVDD4
30
R_BIAS
31
AVDD6
32
P2_4/XOSC32K_Q1
33
P2_3/XOSC32K_Q2
34
P2_2
35
P2_1
36
P2_0
37
P1_7
38
P1_6
39
DVDD1
40
DCOUPL
41
GND_PAD

Pricing

Supplier Part Number # In Stock 11025100250500  
Digi-Key (USD) 296-27922-6-ND 7916 6.776.0635.4524.9585 Buy Now
Digi-Key (USD) 296-27922-2-ND 7750 4.34753.901 Buy Now
Digi-Key (USD) 296-27922-1-ND 7916 6.776.0635.4524.9585 Buy Now

Contributors

Datasheet Preview

CC2540F128, CC2540F256
www.ti.com
SWRS084F OCTOBER 2010REVISED JUNE 2013
2.4-GHz Bluetooth
®
low energy System-on-Chip
Check for Samples: CC2540F128, CC2540F256
1
FEATURES
A
TPS62730 Compatible
23456
True Single-Chip BLE Solution: CC2540 Can
Low Power in Active Mode
Run Both Application and BLE Protocol Stack,
Includes Peripherals to Interface With Wide
RX Down to 15.8 mA (3 V Supply)
Range of Sensors, Etc.
TX (-6 dBm): 18.6 mA (3 V Supply)
6-mm × 6-mm Package
A
RF
Microcontroller
Bluetooth low energy technology
High-Performance and Low-Power 8051
Compatible
Microcontroller Core
Excellent Link Budget (up to 97 dB),
In-System-Programmable Flash, 128 KB or
Enabling Long-Range Applications Without
256 KB
External Front End
8-KB SRAM
Accurate Digital Received Signal-Strength
A
Indicator (RSSI)
Peripherals
Suitable for Systems Targeting Compliance
12-Bit ADC with Eight Channels and
With Worldwide Radio Frequency
Configurable Resolution
Regulations: ETSI EN 300 328 and EN 300
Integrated High-Performance Op-Amp and
440 Class 2 (Europe), FCC CFR47 Part 15
Ultralow-Power Comparator
(US), and ARIB STD-T66 (Japan)
General-Purpose Timers (One 16-Bit, Two
Layout
8-Bit)
Few External Components
21 General-Purpose I/O Pins (19× 4 mA,
Reference Design Provided
20 mA)
6-mm × 6-mm QFN40 Package
32-kHz Sleep Timer With Capture
Low Power
Two Powerful USARTs With Support for
Active Mode RX Down to 19.6 mA
Several Serial Protocols
Active Mode TX (–6 dBm): 24 mA
Full-Speed USB Interface
Power Mode 1 (3-μs Wake-Up): 235 μA
IR Generation Circuitry
Power Mode 2 (Sleep Timer On): 0.9 μA
Powerful Five-Channel DMA
Power Mode 3 (External Interrupts): 0.4 μA
AES Security Coprocessor
Wide Supply Voltage Range (2 V–3.6 V)
Battery Monitor and Temperature Sensor
Full RAM and Register Retention in All
Each CC2540 Contains a Unique 48-bit
Power Modes
IEEE Address
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2SmartRF is a trademark of Texas Instruments.
3Bluetooth is a registered trademark of Bluetooth SIG, Inc.
4Supported by IAR Embedded Workbench is a trademark of IAR Systems AB.
5ZigBee is a registered trademark of ZigBee Alliance.
6All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CC2540F128, CC2540F256
SWRS084F OCTOBER 2010REVISED JUNE 2013
www.ti.com
SOFTWARE FEATURES APPLICATIONS
Bluetooth v4.0 Compliant Protocol Stack for 2.4-GHz Bluetooth low energy Systems
Single-Mode BLE Solution
Mobile Phone Accessories
Complete Power-Optimized Stack,
Sports and Leisure Equipment
Including Controller and Host
Consumer Electronics
GAP – Central, Peripheral, Observer, or
Human Interface Devices (Keyboard, Mouse,
Broadcaster (Including Combination
Remote Control)
Roles)
USB Dongles
ATT / GATT – Client and Server
Health Care and Medical
SMP – AES-128 Encryption and
Decryption
CC2540 WITH TPS62730
L2CAP
TPS62730 is a 2 MHz Step Down Converter
Sample Applications and Profiles
with Bypass Mode
Generic Applications for GAP Central
Extends Battery Lifetime by up to 20%
and Peripheral Roles
Reduced Current in TX and RX
Proximity, Accelerometer, Simple Keys,
30 nA Bypass Mode Current to Support Low
and Battery GATT Services
Power Modes
Multiple Configuration options
RF Performance Unchanged
Single-Chip Configuration, Allowing
Small Package Allows for Small Solution Size
Application to Run on CC2540
CC2540 Controllable
Network Processor Interface for
Applications Running on an External
Microcontroller
BTool – Windows PC Application for
Evaluation, Development, and Test
Development Tools
CC2540 Mini Development Kit
SmartRF™ Software
Supported by IAR Embedded Workbench™
Software for 8051
DESCRIPTION
The CC2540 is a cost-effective, low-power, true system-on-chip (SoC) for Bluetooth low energy applications. It
enables robust BLE master or slave nodes to be built with very low total bill-of-material costs. The CC2540
combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable
flash memory, 8-KB RAM, and many other powerful supporting features and peripherals. The CC2540 is suitable
for systems where very low power consumption is required. Very low-power sleep modes are available. Short
transition times between operating modes further enable low power consumption.
The CC2540 comes in two different versions: CC2540F128/F256, with 128 and 256 KB of flash memory,
respectively.
Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540F128/F256 forms
the market’s most flexible and cost-effective single-mode Bluetooth low energy solution.
2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: CC2540F128 CC2540F256
RESET
WATCHDOG
TIMER
IRQ CTRL
FLASH CTRL
DEBUG
INTERFACE
CLOCK MUX
and
CALIBRATION
DMA
8051 CPU
CORE
32-MHz
CRYSTAL OSC
OP-AMP
32.768-kHz
CRYSTAL OSC
HIGH-
SPEED
RC-OSC
POWER MANAGEMENT CONTROLLER
USART 0
USB
USART 1
TIMER 1 (16-Bit)
TIMER 3 (8-Bit)
TIMER 4 (8-Bit)
TIMER 2
(BLE LL TIMER)
FLASH
FIFOCTRL
1 KB SRAM
ON-CHIP VOLTAGE
REGULATOR
POWER-ON RESET
BROWN OUT
VDD (2 V–3.6 V)
DCOUPL
RESET_N
XOSC_Q2
XOSC_Q1
P2_4
P1_7
P0_7
P2_3
P1_6
P0_6
P2_2
P1_5
P0_5
P1_2
P0_2
P2_1
P1_4
P0_4
P1_1
P0_1
P2_0
P1_3
P0_3
P1_0
P0_0
MODULATOR
DEMODULATOR
RECEIVE
TRANSMIT
FREQUENCY
SYNTHESIZER
SYNTH
RF_P
RF_N
B0301-05
RADIO REGISTERS
SFR Bus
SFR Bus
DS
ADC
AUDIO/DC
AES
ENCRYPTION
AND
DECRYPTION
MEMORY
ARBITRATOR
FLASH
UNIFIED
SFR
IRAM
XRAM
PDATA
SLEEP TIMER
32-kHz
RC-OSC
I/O CONTROLLER
DIGITAL
ANALOG
MIXED
ANALOG COMPARATOR
USB_N
USB_P
Radio Arbiter
Link Layer Engine
CC2540F128, CC2540F256
www.ti.com
SWRS084F OCTOBER 2010REVISED JUNE 2013
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: CC2540F128 CC2540F256
CC2540F128, CC2540F256
SWRS084F OCTOBER 2010REVISED JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
MIN MAX UNIT
Supply voltage All supply pins must have the same voltage –0.3 3.9 V
–0.3 VDD + 0.3,
Voltage on any digital pin V
3.9
Input RF level 10 dBm
Storage temperature range –40 125 °C
All pads, according to human-body model, JEDEC STD 22, method A114 2 kV
ESD
(2)
According to charged-device model, JEDEC STD 22, method C101 750 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) CAUTION: ESD sensitive device. Precautions should be used when handing the device in order to prevent permanent damage.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
Operating ambient temperature range, T
A
–40 85 °C
Operating supply voltage 2 3.6 V
ELECTRICAL CHARACTERISTICS
Measured on Texas Instruments CC2540 EM reference design with T
A
= 25°C and VDD = 3 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power mode 1. Digital regulator on; 16-MHz RCOSC and 32-
MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD and 235
sleep timer active; RAM and register retention
Power mode 2. Digital regulator off; 16-MHz RCOSC and 32-
µA
MHz crystal oscillator off; 32.768-kHz XOSC, POR, and sleep 0.9
I
core
Core current consumption
timer active; RAM and register retention
Power mode 3. Digital regulator off; no clocks; POR active;
0.4
RAM and register retention
Low MCU activity: 32-MHz XOSC running. No radio or
6.7 mA
peripherals. No flash access, no RAM access.
Timer 1. Timer running, 32-MHz XOSC used 90 μA
Timer 2. Timer running, 32-MHz XOSC used 90 μA
Peripheral current consumption
Timer 3. Timer running, 32-MHz XOSC used 60 μA
I
peri
(Adds to core current I
core
for each
Timer 4. Timer running, 32-MHz XOSC used 70 μA
peripheral unit activated)
Sleep timer, including 32.753-kHz RCOSC 0.6 μA
ADC, when converting 1.2 mA
4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: CC2540F128 CC2540F256