Texas Instruments TPD4S012DRYR

Reference Designs (27)

Attributes

Part Number
Manufacturer
Datasheet
Prefix
U
Digikey Description
Digikey Part Number
Imported From Octopart
yes
Lead Free
yes
Mfg Package Ident
DRY
Mouser Part Number
Octopart Part Number
1030076719068
Package
SON6
RoHS
yes
Temperature Range High
Temperature Range Low
Verified Attributes
true
Verified Geometry
true
Verified Pad Assignment
true
Verified Pin Names
true
Number Of Channels
4

Pins

1
D+
2
D-
3
ID
4
GND
5
N.C.
6
VBUS

Contributors

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PMU/USB Controller
V
BUS
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D-
GND
ID
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TPD4S012
SLVS928B MARCH 2009REVISED AUGUST 2014
TPD4S012 4-Channel ESD Solution for USB-HS/USB OTG/USB Charger Interface
1 Features 3 Description
The TPD4S012 is a four-channel Transient Voltage
1
Integrated ESD Clamps on all Pins
Suppressor (TVS) based Electrostatic Discharge
USB Signal Pins (D+, D–, ID)
(ESD) protection diode array for USB chargers and
0.8-pF Line Capacitance
USB On-The-Go (OTG) interfaces.
Supports Data Rates in Excess of 480 Mbps
The TPD4S012 provides IEC 61000-4-2 system level
IEC 61000-4-2 ESD Protection (Level 4 Contact)
ESD Protection featuring 15 V tolerance on the V
BUS
line. The device is ideal for providing circuit protection
±10-kV IEC 61000-4-2 Contact Discharge
for USB charger and OTG applications due to its
IEC 61000-4-5 Surge
high-voltage tolerance at the V
BUS
line and small flow-
3 Amps Peak Pulse Current
through package.
Device Information
(1)
2 Applications
PART NUMBER PACKAGE BODY SIZE (NOM)
Cellular Phones
TPD4S012 SON (6) 1.45 mm x 1.00 mm
Digital Cameras
(1) For all available packages, see the orderable addendum at
Global Positioning Systems (GPS)
the end of the datasheet.
Portable Digital Assistants (PDA)
Portable Computers
Typical Application Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPD4S012
SLVS928B MARCH 2009REVISED AUGUST 2014
www.ti.com
Table of Contents
7.3 Feature Description .................................................. 8
1 Features.................................................................. 1
7.4 Device Functional Modes.......................................... 9
2 Applications ........................................................... 1
8 Applications and Implementation ...................... 10
3 Description ............................................................. 1
8.1 Application Information............................................ 10
4 Revision History..................................................... 2
8.2 Typical Application .................................................. 10
5 Pin Configurations and Functions....................... 3
9 Power Supply Recommendations...................... 12
6 Specifications......................................................... 4
10 Layout................................................................... 12
6.1 Absolute Maximum Ratings ...................................... 4
10.1 Layout Guidelines ................................................. 12
6.2 Handling Ratings....................................................... 4
10.2 Layout Example .................................................... 12
6.3 Recommended Operating Conditions....................... 4
11 Device and Documentation Support ................. 13
6.4 Thermal Information.................................................. 4
11.1 Trademarks........................................................... 13
6.5 Electrical Characteristics........................................... 5
11.2 Electrostatic Discharge Caution............................ 13
6.6 Typical Characteristics.............................................. 6
11.3 Glossary................................................................ 13
7 Detailed Description.............................................. 8
12 Mechanical, Packaging, and Orderable
7.1 Overview ................................................................... 8
Information ........................................................... 13
7.2 Functional Block Diagram......................................... 8
4 Revision History
Changes from Revision A (November 2009) to Revision B Page
Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
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Product Folder Links: TPD4S012
5
6
4
2
3
1
D+
D-
ID
V
BUS
N.C.
GND
DRY PACKAGE
(TOP VIEW)
TPD4S012
www.ti.com
SLVS928B MARCH 2009REVISED AUGUST 2014
5 Pin Configurations and Functions
N.C. Not internally connected
D+, D–, and ID pins are exact equivalent ESD clamp circuits. Any of these pins can be connected to any other D+,
D–, or ID pin if it becomes easier to route the traces from the USB connector.
Pin Functions
PIN
TYPE DESCRIPTION
DRY
NAME
PIN NO.
1 D+ ESD clamp Provides ESD protection to the high-speed differential data lines
2 D– ESD clamp Provides ESD protection to the high-speed differential data lines
3 ID ESD clamp Provides ESD protection to the high-speed differential data lines
4 GND PWR Ground
5 N.C. Not internally connected
6 V
BUS
ESD clamp ESD clamp for high-voltage tolerant V
BUS
line(s)
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TPD4S012
SLVS928B MARCH 2009REVISED AUGUST 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
V
BUS
voltage tolerance V
BUS
pin –0.3 20 V
IO voltage tolerance D+, D–, ID pins –0.3 6 V
T
A
Operating free-air temperature range –40 85 °C
IEC 61000-4-2 Contact Discharge D+, D–, ID ±10 kV
V
BUS
pin ±10 kV
IEC 61000-4-2 Air-Gap Discharge D+, D–, ID ±10 kV
V
BUS
pin ±9 kV
Peak pulse Power (All pins) 60 W
IEC 61000-4-5 Surge (t
p
= 8/20 μs)
Peak pulse current (All Pins) 3 A
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 125 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all –2.5 2.5
pins
(1)
V
(ESD)
Electrostatic discharge kV
Charged device model (CDM), per JEDEC specification –1 1
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
T
A
Operating free-air Temperature Range –40 85 °C
Operating Voltage V
BUS
Pin 0 15 V
D+, D–, ID Pins 0 5.5
6.4 Thermal Information
TPD4S012
THERMAL METRIC
(1)
DRY UNIT
6 PINS
R
θJA
Junction-to-ambient thermal resistance 461.3
R
θJC(top)
Junction-to-case (top) thermal resistance 219.6
R
θJB
Junction-to-board thermal resistance 343.7 °C/W
ψ
JT
Junction-to-top characterization parameter 162.5
ψ
JB
Junction-to-board characterization parameter 343.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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Product Folder Links: TPD4S012