Texas Instruments TPD6E001RSER

Reference Designs (3)

Attributes

Part Number
Manufacturer
Datasheet
Prefix
U
Digikey Description
Digikey Part Number
Lead Free
Yes
Mfg Package Ident
RSE (R-PUQFN-N10)
Mouser Part Number
Octopart Part Number
Package
QFN10
RoHS
Yes
Temperature Range High
Temperature Range Low
Mounting Type
Surface Mount
Other Names
296-21888-6
Package / Case
10-UFQFN
Polarization
6 Channel Array - Bidirectional
Supplier Device Package
10-UQFN (2.0x1.5)
Voltage - Breakdown
11V

Pins

1
IO1
2
IO2
3
IO3
4
NC
5
GND
6
IO4
7
IO5
8
IO6
9
NC
10
VCC

Contributors

Datasheet Preview

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FEATURES APPLICATIONS
N.C. – Not internally connected
RSE PACKAGE
(TOP VIEW)
IO1
N.C.
N.C.
GND
1
IO6
V
CC
IO5
IO2
IO3
IO4
2
5
6
7
8
9
10
3
4
RSF PACKAGE
(TOP VIEW)
N.C.
N.C.
N.C.
N.C.
GND
GND
IO6
V
CC
IO5
IO1
IO2
IO3 IO4
4 5 6
7
8
9
3
2
1
1112 10
DESCRIPTION/ORDERING INFORMATION
TPD6E001
LOW-CAPACITANCE 6-CHANNEL ± 15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS685C JULY 2006 REVISED APRIL 2007
UBB
ESD Protection Exceeds
USB 2.0
± 15-kV Human-Body Model (HBM)
Ethernet
± 8-kV IEC 61000-4-2 Contact Discharge
FireWire™
± 15-kV IEC 61000-4-2 Air-Gap Discharge
Video
Low 1.5-pF Input Capacitance
Cell Phones
Low 1-nA (Max) Leakage Current
SVGA Video Connections
Low 1-nA Supply Current
Glucosemeters
0.9-V to 5.5-V Supply-Voltage Range
Six-Channel Device
Space-Saving RSE and RSF Packages
Alternate 2-, 3-, 4-Channel Options Available:
TPD2E001, TPD3E001, and TPD4E001
The TPD6E001 is a low-capacitance ± 15-kV ESD-protection diode array designed to protect sensitive
electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current
pulses to V
CC
or GND. The TPD6E001 protects against ESD pulses up to ± 15-kV Human-Body Model (HBM),
± 8-kV Contact Discharge, and ± 15-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a
1.5-pF capacitance per channel, making it ideal for use in high-speed data IO interfaces.
The TPD6E001 is a six-channel device designed for cell-phone connectors and SVGA video connections.
The TPD6E001 is available in tiny RSE and RSF packages and is specified for –40 ° C to 85 ° C operation.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
2 × 1.5 RSE Reel of 3000 TPD6E001RSER 2DO
–40 ° C to 85 ° C
4 × 4 RSF Reel of 2000 TPD6E001RSFR ZWN
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com .
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FireWire is a trademark of Apple Computer, Inc.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
www.ti.com
IO5 IO6
GND
IO2 IO3 IO4IO1
V
CC
Absolute Maximum Ratings
(1)
TPD6E001
LOW-CAPACITANCE 6-CHANNEL ± 15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS685C JULY 2006 REVISED APRIL 2007
LOGIC BLOCK DIAGRAM
PIN DESCRIPTION
RSE NO. RSF NO. NAME FUNCTION
1, 2, 3, 1, 2, 3,
IOx ESD-protected channel
6, 7, 8 7, 8, 9
5 5 GND Ground
10 11 V
CC
Power-supply input. Bypass V
CC
to GND with a 0.1- µ F ceramic capacitor.
4, 9 4, 6, 10, 12 N.C. Not internally connected
EP EP Exposed pad. Connect to GND.
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
–0.3 7 V
V
I/O
–0.3 V
CC
+ 0.3 V
T
stg
Storage temperature range –65 150 ° C
T
J
Junction temperature 150 ° C
Infrared (15 s) 220
Bump temperature (soldering) ° C
Vapor phase (60 s) 215
Lead temperature (soldering, 10 s) 300 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
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Electrical Characteristics
ESD Protection
TPD6E001
LOW-CAPACITANCE 6-CHANNEL ± 15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS685C JULY 2006 REVISED APRIL 2007
V
CC
= 5 V ± 10%, T
A
= -40 ° C to 85 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
V
CC
Supply voltage 0.9 5.5 V
I
CC
Supply current 1 100 nA
V
F
Diode forward voltage I
F
= 10 mA 0.65 0.95 V
V
BR
Breakdown voltage I
BR
= 10 mA 11 V
Positive transients V
CC
+ 25
T
A
= 25 ° C, ± 15-kV HBM,
I
F
= 10 A
Negative transients –25
T
A
= 25 ° C, Positive transients V
CC
+ 60
± 8-kV Contact Discharge
V
C
Channel clamp voltage
(2)
V
Negative transients –60
(IEC 61000-4-2), I
F
= 24 A
T
A
= 25 ° C, Positive transients V
CC
+ 100
± 15-kV Air-Gap Discharge
Negative transients –100
(IEC 61000-4-2), I
F
= 45 A
I
i/o
Channel leakage current V
i/o
= GND to V
CC
± 1 nA
Channel input
C
i/o
V
CC
= 5 V, Bias of V
CC
/2 1.5 pF
capacitance
(1) Typical values are at V
CC
= 5 V and T
A
= 25 ° C.
(2) Channel clamp voltage is not production tested.
PARAMETER TYP UNIT
HBM ± 15 kV
IEC 61000-4-2 Contact Discharge ± 8 kV
IEC 61000-4-2 Air-Gap Discharge ± 15 kV
3
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TYPICAL OPERATING CHARACTERISTICS
0.00 1.00 2.00 2.50 3.00 4.00 5.00
IO Voltage (V)
1.00
1.20
1.40
1.60
1.80
2.00
2.20
IO Capacitance (pF)
1
10
100
1000
–40 25 45 65 85
Temperature (°C)
IO Leaka
ge Current (pA)
TPD6E001
LOW-CAPACITANCE 6-CHANNEL ± 15-kV ESD-PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS685C JULY 2006 REVISED APRIL 2007
IO CAPACITANCE
vs
IO VOLTAGE
(V
CC
= 5.0 V)
IO LEAKAGE CURRENT
vs
TEMPERATURE
(V
CC
= 5.5 V)
4
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