SparkFun BOB-08688

Reference Designs (4)

Attributes

Part Number
Manufacturer
Datasheet
Prefix
U
Lead Free
???
Octopart Part Number
Package
RoHS
???

Pins

1
OUT
2
GND
3
VCC

Contributors

Datasheet Preview

VISHAY
TEMT6000
Document Number 81579
Rev. 1.2, 08-Jul-04
Vishay Semiconductors
www.vishay.com
1
18527
Ambient Light Sensor
Description
TEMT6000 is a silicon NPN epitaxial planar pho-
totransistor in a miniature transparent mold for sur-
face mounting onto a printed circuit board. The device
is sensitive to the visible spectrum.
Features
Adapted to human eye responsivity
Wide angle of half sensitivity ϕ = ± 6
SMD style package on PCB technology
Suitable for IR reflow soldering
Lead free component
Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Applications
Ambient light sensor for display backlight dimming in:
Mobile phones
Notebook computers
PDA’s
Cameras
Dashboards
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Parameter Test condition Symbol Value Unit
Collector Emitter Voltage V
CEO
6V
Emitter Collector Voltage V
ECO
1.5 V
Collector current I
C
20 mA
Total Power Dissipation T
amb
55 °C P
tot
100 mW
Junction Temperature T
j
100 °C
Operating Temperature Range T
amb
- 40 to + 85 °C
Storage Temperature Range T
stg
- 40 to + 85 °C
Soldering Temperature t 3 s T
sd
260 °C
Thermal Resistance Junction/
Ambient
R
thJA
450 K/W
www.vishay.com
2
Document Number 81579
Rev. 1.2, 08-Jul-04
VISHAY
TEMT6000
Vishay Semiconductors
Basic Characteristics
T
amb
= 25 °C, unless otherwise specified
Typical Characteristics (T
amb
= 25 °C unless otherwise specified)
Parameter Test condition Symbol Min Ty p. Max Unit
Collector Emitter Breakdown
Voltage
I
C
= 0.1 mA V
CEO
6V
Collector dark current V
CE
= 5 V, E = 0 I
CEO
350nA
Collector-emitter capacitance V
CE
= 0 V, f = 1 MHz, E = 0 C
CEO
16 pF
Collector Light Current E
v
= 20 lx, standard light A I
ca
3.5 10 16 µA
E
v
= 100 lx, standard light A I
ca
50 µA
Angle of Half Sensitivity ϕ ±60 deg
Wavelength of Peak Sensitivity λ
p
570 nm
Range of Spectral Bandwidth λ
0.1
360 to 970 nm
Collector Emitter Saturation
Voltage
E
v
= 20 lx, 0.45 µAV
CEsat
0.1 V
Figure 1. Collector Light Current vs. Illuminance
Figure 2. Relative Spectral Responsivity vs. Wavelength
19006
1
10
100
1000
10 100 1000
E
v
- Illuminance ( lx )
I - Collector Light Current ( A )
ca
µ
0.0
0.2
0.4
0.6
0.8
1.0
1.2
300 400 500 600 700 800 900 1000 1100
18465
λ - Wavelength ( nm )
S ( ) - Relative Spectral Sensitivity
rel
λ
Figure 3. Relative Radiant Sensitivity vs. Angular Displacement
0.4 0.2 0 0.2 0.4
S - Relative Sensitivity
rel
0.6
94 8318
0.6
0.9
0.8
0°°
30°
10 20
40°
50°
60°
70°
80°
0.7
1.0
°
VISHAY
TEMT6000
Document Number 81579
Rev. 1.2, 08-Jul-04
Vishay Semiconductors
www.vishay.com
3
Reflow Solder Profiles
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMT6000 is released for:
Moisture Sensitivity Level 4, according to
JEDEC, J-STD-020
Floor Life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h @ 40 °C (+ 5 °C), RH < 5 %
Figure 4. Lead-Free (Sn) Reflow Solder Profile
Figure 5. Lead Tin (SnPb) Reflow Solder Profile
180
20
Temperature( C)
°
20s
~
30 s
~
40 s120 s
~
125 C
°
145 C
°
210 C
°
250 C
°
260 C
°
280
260
240
220
200
180
160
140
80
60
40
100
120
0
0609030 150120 210 240 270 300
Time(s)
Preheat Reflow Cooling
19030
max. 160 C
full line : typical
dotted line : process limits
Time ( s )
Temperature ( C )
Lead Temperature
90s-120s
300
250
200
150
100
50
0
0 50 100 150 200 250
max. 240 C ca. 230 C
10 s
215 C
max40s
2 K/s - 4 K/s
94 8625
°°
°
°
°
www.vishay.com
4
Document Number 81579
Rev. 1.2, 08-Jul-04
VISHAY
TEMT6000
Vishay Semiconductors
Package Dimensions in mm
18464