Attributes

Part Number
L298P
Footprint 0 Description
SOP, 20-Leads, Body 15.9x11mm, Pitch 1.27mm, IPC Medium Density
Manufacturer
ST Microelectronics
Footprint 1 Description
SOP, 20-Leads, Body 15.9x11mm, Pitch 1.27mm, IPC High Density
Description
Dual Full Bridge Driver
Code Jedec
MO-166
Prefix
U
Manufacturer Link
http://www.st.com/

Design Files