Attributes
Part Number
MT8870DS1
Footprint 1 Description
SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC High Density
Manufacturer
Microsemi
Footprint 0 Description
SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Medium Density
Description
Integrated DTMF Receiver
Footprint 2 Description
SOIC, 18-Leads, Body 11.6x7.6mm, Pitch 1.27mm, IPC Low Density
Prefix
U
Centroid Not Specified
No
Show More
Show Less
Design Files
